2024 International Electronic Circuits (Shanghai) Exhibition
The 2024 International Electronic Circuits (Shanghai) Exhibition is scheduled to take place from May 13th to May 15th, 2024, at the National Exhibition and Convention Center (Shanghai). We cordially invite you to visit us at Booth 7M62.
A. Accuracy and Automatic Calibration
1. < ±20mm synchronous linear and surface compensation for repeated drilling accuracy in X and Y directions.
2. < ±10mm drilling accuracy for Mark Center Drilling.
3. X-ray tube and camera are designed with coaxial moving mechanism to improve the stability of the drilling target.
4. The system uses a new generation X-ray camera with higher stability and longer lifespan, with a drift range of only 0.1 pixels.
5. Programmable post-drilling inspection.
6. Layer shift detection and measurement to determine whether a substrate is "GO/NO GO" and identify defective substrates for removal.
7. The drilling axis uses a brushless DC servo motor, with high torque output and minimal axis deviation.
8. The drilling speed can be programmatically set from 100 to 40,000 r.p.m.
9. The system includes a self-calibration function to ensure overall accuracy of drilling targets during mass production.
10 The optional substrate paving and flatting mechanical system to ensure the surface quality of drilled hole
B. System Stability
1. Mature assembly process and high-quality components do not require special adjustment while installation.
2. The drilling axis uses self-lubricating bearings to extend the lifespan of the drill.
3. The system includes built-in X-ray leakage protection and isolation design to prevent external X-ray leakage.
4. The machine's stability during operation is increased through the use of a large-area heavy-duty cast iron base.
C. High Output Capacity
1. Industry's largest field of view X-ray camera, convenient for substrate placement and operation.
2. Provide both manual and auto mode on learning target as well as drilling.
3. Working data and setting parameters, including X-ray voltage, current, imaging, drilling speed, and other parameters, can be accessed and stored together with the part number.
4. The drilling speed and ascent rate can be programmatically set.
D. Intelligent Optimization Software
1. Built-in automatic image contrasting and averaging.
2. Built-in X-ray camera plane error automatic correction software function.
3. Automatic calculation of optimization surface compensation numerical methods and CAM design coordinate virtual rotation surface measurement software.
4. Provides variety drilling mode such as linear compensation, 3 or 4 points flat surface compensation and N/C Drilling.
5. Non-standard drilling modes can be customized according to customer design requirements.
6. Complete SPC report and drilling classification function.
E. Industry 4.0 Smart Manufacturing
1. The system can be integrated with front-end and back-end equipment and robotic arms for unmanned operations according to customer needs.
2. The system can be adjusted to meet the smart manufacturing requirements of uploading production parameters and equipment action parameters to the customer's MES system.
Since 2001, ABLETEK has been continuously improving equipment quality and enhancing X-RAY target drilling technology and efficiency in the field of X-ray drilling for printed circuit boards. To date, the ABLETEK ADT-900 series X-ray drilling machines have been installed in nearly 800 world-wide and applied in the production of various types of printed circuit boards, such as multi-layer FPCB, various types of multi-layer PCB for IT use, high-density inter-connection (HDI) PCB, IC substrate, high-frequency communication related PCB, automotive related PCB, military-specification boards, etc. We can confidently say that we are the only X-ray drilling machine maker in the industry with the most comprehensive production records of various types of printed circuit boards, as we provide not only equipment but also our experience and technology.
In recent years, major printed circuit board manufacturers have continued to adopt Industry 4.0 unmanned factories, factory automation, and smart manufacturing. We have integrated automated board load/unload systems and extended various applications such as laser marking and mechanical arm sorting systems that greatly save space. In terms of smart manufacturing, we also assist customers in providing MES system connections as well as uploading equipment and production parameters to meet customer needs.
Total copper thickness:0.3 ~ 16 OZ
Substrate Thickness:Min≧ 0.1mm (including copper)
Inner Layer Copper Thickness:12 um ～105 um
PCB Warpage:< 5mm
CCD Image Acquisition:No similar targets or circular marks within ± 20mm range
Drill Hole Diameter:3.175 ~ 5.0mm (Max.) (drill shank diameter is 3.175mm)
STD Working Panel Size:Board X/Y: 780 × 670mm (Max.), Board X/Y: 310 × 210mm (Min.)
STD Drilling Target Distance:X-axis distance: 300 ~ 740 mm, Y-axis distance: 0 ~ 600 mm
Standard Working Panel Thickness:0.3 ~ 8.0mm,below 0.3mm (to be discussed)
★Optional dedicated deburring/deflashing device available
